Blade Wear and Wafer Chipping in Dicing Processes.
نویسندگان
چکیده
منابع مشابه
Multi-Project Reticle Design and Wafer Dicing under Uncertain Demand∗
The pervasive use of advanced reticle enhancement technologies demanded by VLSI technology scaling leads to dramatic increases in mask costs. In response to this trend, multiple project wafers (MPW) have been proposed as an effective technique for sharing the cost of mask tooling among up to tens of prototype and low volume designs. Previous works on MPW reticle design and dicing have focused o...
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As semiconductor process technology relentlessly advances into deeper submicron feature sizes following the Moore’s Law, the cost of mask tooling is growing inexorably, up to 1, 1.5, and 3 million dollars for 90nm, 65nm, and 32nm process technology, respectively (LaPedus, 2006). Basically, the majority of smaller fabless integrated circuit (IC) design houses can hardly afford to have one mask s...
متن کاملComparison of Carburizing and Boronizing Processes on Mechanical and Wear Properties of PM Parts
In this study carburizing and boronizing processes were applied to powder metallurgy steel specimens and the mechanical and tribological properties of the substrate and coatings were evaluated under various process conditions. The specimens, made from industrial test pieces, were carburized in a powder pack for a duration of 2-5 hrs at 850-950 ˚C. Similar specimens were pack boronized for 4 hr...
متن کاملComparison of Carburizing and Boronizing Processes on Mechanical and Wear Properties of PM Parts
In this study carburizing and boronizing processes were applied to powder metallurgy steel specimens and the mechanical and tribological properties of the substrate and coatings were evaluated under various process conditions.
The specimens, made from industrial test pieces, were carburized in a powder pack for a duration of 2-5 hrs at 850-950 ˚C. Similar specimens were pack boronized for 4 ...
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physics.ubs.ca Imagine stepping off the edge of a swimming pool, only to find that your foot deflects the surface of the water without breaking it, as if held by some impenetrable skin. As you walk forward, the water continues to support you; but if you take a running leap and bring your full weight down on the surface, then it snaps open to envelop you without a splash. Rather than plunging to...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
سال: 1999
ISSN: 0387-5024,1884-8354
DOI: 10.1299/kikaic.65.801